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基于GRA微细铣削单晶硅工艺参数优化及试验研究
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苏州科技大学

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Study on process parameter optimization and test of monocrystalline silicon based on GRA microfine milling
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1.苏州科技大学;2.Suzhou University of Science and Technology

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    摘要:

    为满足实际应用中对单晶硅微槽底部的表面粗糙度、上口尺寸精度以及材料去除率的需求,加工方法选择微细铣削,并利用灰色关联度分析法(GRA)对以上三种评价指标进行参数优化。首先通过设计正交试验,获得评价指标的预测值,并分析了各个指标与工艺参数之间的关系。然后运用灰色关联法计算出试验序列各评价指标的灰色关联系数,并对各个试验序列的灰色关联度进行了排序,从而得到了最佳工艺参数组合,并进行了多次实验来验证其可行性,以用于提高微槽的加工质量与加工精度。

    Abstract:

    In order to meet the requirements of surface roughness, upper port size precision and material removal rate of the bottom of monocrystalline silicon microgroove in practical application, the processing method selects fine milling, and the above three evaluation indexes are optimized by gray correlation analysis (GRA). Firstly, by designing the orthogonal test, the predicted value of the evaluation index is obtained, and the relationship between each index and the process parameters is analyzed. Then the grey correlation method is used to calculate the grey correlation coefficient of each evaluation index of the test sequence, and then the grey correlation degree of each test sequence is ranked, so as to obtain the best combination of process parameters, and many experiments are carried out to verify its feasibility, so as to improve the processing quality and processing accuracy of the microgroove.

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  • 收稿日期:2023-07-05
  • 最后修改日期:2023-09-06
  • 录用日期:2023-09-12
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