In the process of processing the glass substrate used for microelectronics, it is necessary to cut the large plate glass into small plates.The cutting of the glass substrate usually use the means of mechanical positioning.However,when using the means of mechanical positioning,the positioning fixture contacts with the workpiece mechanically, and the side of the workpiece is under the pressure of the positioning fixture, which is prone to deformation or crack or other defects due to external force, so the yield is low.Aimed at above problems, the production equipment of cutting and breaking of glass substrates based on visual positioning was designed, and the overall design scheme, structure composition, function and control flow of visual positioning system of cutting and breaking mechanism of glass substrates were discussed. In the process of loading, cutting and breaking, the linear array camera identification system was used for initial alignment and automatic alignment respectively, which reduces the edge breakage and angle breakage of single piece of glass, and improves the edge quality of the single piece of glass.