At present, in the research and development of IC packaging equipment, the mechanical precision design mostly relies on modeled analog and experience. The relationship between the overall accuracy of device and precision of parts has not been analyzed systematically. To solve this problem, combined with the special structure of flip-chip bonding equipment, the geometric error model of the flip-chip bonding equipment was established based on multi-body system theory. In addition，the accuracy design based on geometric error model was studied. It provides reference for the systemic and reasonable accuracy design of flip-chip bonding equipment.