According to the Hetian jade characteristics of high hardness and high toughness, a large aperture inside chip removal ultrasonic vibration deep-hole drilling system was designed. Key parts of drilling head and vibration system were introduced mainly. The theory was researched for large aperture, inside chip removal method ultrasonic vibration deep-hole drilling. It provides theoretical basis for research in later stage of Hetian jade ultrasonic deep-hole processing mechanism and cleft preventive strategy.