Bonding precision is the core index of flipchip bonding machine, and accurate error analysis is the precondition for the precision design of flipchip bonding machine. In order to achieve the reasonable precision design that precision requirement and cost achieve the best matching, various error sources of precision for flipchip bonding machine were systematically analyzed. The result that geometric error is the main factors influencing the precision of bonding was obtained. At last, the mechanism of flipchip bonding machine was minutely analyzed and the geometric error affecting bonding precision of related parts was found out, and the transmission of geometric error was analyzed,which laid the foundation for subsequent precision design.