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单片机控制的小型锥面密封副研配装置研制
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Development of Small Cone Seal Pair Grinding Device Controlled by MCU
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    摘要:

    为了提高小型锥面密封副的密封性能,减小表面粗糙度,研制了一种单片机控制的小型锥面密封副研配装置。采用了垂直布局方案,该装置主要由旋转研磨机构、升降机构、定位夹紧机构和机座支架组成。简述了装置的工作原理,并根据各机构功能,完成了结构设计;采用STC89C52单片机作为控制系统,步进电机作为驱动元件,提高了小型锥面密封副的密封性能和效率。

    Abstract:

    In order to improve sealing performance and reduce the surface roughness of miniature cone seal pair, a small cone seal pair grinding device controlled by MCU was developed. With vertical layout scheme, the device mainly composed of rotating grinding mechanism, lifting mechanism, locating and clamping mechanism and frame. The working principle of the device was briefly described. According to the functions of every mechanism, their structures were designed. STC89C52 MCU was selected as the control system, and the device was driven by the stepping motors. Using the device, sealing performance of small cone seal pair and the efficiency are improved.

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引用本文

刘旭,贾光政,边颖聪.单片机控制的小型锥面密封副研配装置研制[J].机床与液压,2017,45(8):169-172.
. Development of Small Cone Seal Pair Grinding Device Controlled by MCU[J]. Machine Tool & Hydraulics,2017,45(8):169-172

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  • 在线发布日期: 2017-07-03
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