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飞秒激光烧蚀单晶硅片的表面质量视觉检测
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国家自然科学基金资助项目(71601039)


Visual Inspection of Surface Quality of Monocrystalline Silicon Wafer Ablated by Femtosecond Laser
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    摘要:

    使用飞秒激光微加工中心对单晶硅片等材料进行微尺度结构加工时,需保证硅晶片表面、边缘的完好,无瑕疵、污渍及划痕等缺陷。提前识别有破损的晶片对保证飞秒激光烧蚀样品的顺利进行具有实际意义。以飞秒激光烧蚀的单晶硅片为实验样品,分别针对以下一些瑕疵的视觉检测策略进行了研究:硅晶片表面划痕检测、表面污渍检测、边缘瑕疵与破损检测以及硅晶片边缘直线或曲线检测。经实验验证,提出的针对各种晶片表面瑕疵的检测策略是可行的,对提高飞秒激光烧蚀硅晶片的质量具有借鉴价值。

    Abstract:

    When femtosecond laser micromachining center is used to process the microscale structure on silicon wafers,the surface and edge of silicon wafer are needed to be in good condition,and have no defects,such as flaws,stains,scratches and so on.To identify the damaged wafers in advance is of practical significance to guarantee the smooth running of femtosecond laser ablation samples.The silicon wafers ablated by femtosecond laser were used as the experimental samples,and the visual inspection strategies for the following defects were studied respectively:surface scratch detection of silicon wafer,surface stain detection of silicon wafer,edge defects and damage detection of silicon wafer,and the detection for line or curve of silicon wafer edge.The experimental results show that the proposed method is feasible to detect the surface defects of various wafers,and has reference value for improving the quality of femtosecond laser ablated silicon wafers.

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王福斌,刘同乐,武晨,刘洋,陈至坤.飞秒激光烧蚀单晶硅片的表面质量视觉检测[J].机床与液压,2018,46(20):125-127.
. Visual Inspection of Surface Quality of Monocrystalline Silicon Wafer Ablated by Femtosecond Laser[J]. Machine Tool & Hydraulics,2018,46(20):125-127

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  • 在线发布日期: 2019-07-09
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