A microfluidic chip with micron-scale microchannel structure made of cycloolefin copolymer (COC) was taken as the research object,the influence of the key process parameters such as temperature,pressure and time on the microchannel in the bonding process was studied.The influence of process parameters on deformation law was analyzed through multi-physical simulation.The thermocompression bonding experiment and the droplet generation experiment were carried out to check the chip size and the working performance.The research results show that the bonding temperature has the greatest influence on the microchannel deformation of the microfluidic chip near the glass transition temperature of the cycloolefin copolymer,and the bonding pressure is the second,however,the bonding time has an optimal solution within a certain range.The correct thermocompression coupling simulation analysis can better predict the deformation law of the microchannel in the bonding process of the microfluidic chip.