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数字图像相关法在薄板变形测量中的应用
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国家自然科学基金地区科学基金项目(51865057)


Application of Digital Image Correlation Method in Thin Plate Deformation Measurement
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    摘要:

    为研究在一定温度和工况下,金属薄板材料接触面发生的变形情况,利用高温材料变形系统对镍基合金(GH3044)薄板进行一定温度下的特定冲头冲击变形试验。利用基于数字图像相关(DIC)方法的三维散斑测量系统对材料的变形全过程进行实时跟踪测量,获得试件的全场位移和应变,揭示材料在120 ℃时的变形规律。结果表明:利用DIC能够实时准确地捕捉到完整的试验过程和数据;在材料的变形过程中,总位移主要由z向位移贡献,主应变主要由y向应变贡献;在应变分量中,主要以y向的相对移动为主;温度对试件的变形程度影响较大,温度越高,试件的变形程度越大;种子点选择下的区域变形达到100%,且具有大位移的变形区域与冲头的接触面积有关。

    Abstract:

    In order to study the deformation of the contact surface of metal thin plate at a certain temperature and working condition,the deformation experiment of nickel based alloy (GH3044) thin plate with specific punch impact at a certain temperature was carried out by using high temperature material deformation system.A three-dimensional speckle measurement system based on digital image correlation (DIC) method was used to track and measure the whole deformation process of the material in real time to obtain the full field displacement and strain of the specimen,and the deformation laws of the material at 120 ℃ were revealed.The results show that by using DIC method,the whole experimental process and data can be accurately captured in real time;in the deformation process,the total displacement is mainly contributed by z direction displacement,and the principal strain is mainly contributed by y direction strain;in the strain component,the relative movement in y direction is dominant;temperature has a great influence on the deformation of the specimen,the higher the temperature is,the greater the deformation is;the deformation of the area under seed point selection reaches 100% and the deformation area with large displacement is related to the contact area of the punch.

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韩红亮,王立忠,张振,任明阳,付白强.数字图像相关法在薄板变形测量中的应用[J].机床与液压,2022,50(16):13-17.
HAN Hongliang, WANG Lizhong, ZHANG Zhen, REN Mingyang, FU Baiqiang. Application of Digital Image Correlation Method in Thin Plate Deformation Measurement[J]. Machine Tool & Hydraulics,2022,50(16):13-17

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  • 在线发布日期: 2023-02-03
  • 出版日期: 2022-08-28