At present, the cutting efficiency of the traditional circular slicer used in the market can not meet the demand of the increasing monocrystalline silicon wafers. In view of this situation, a new type of high efficiency inner circular slicer which has eight positions is designed. It could process eight pieces of materials at the same time and the productivity was increased by eight times. At the same time, in order to reduce the vibration of the machine tool and improve the precision of the silicon wafer, the natural frequency and quality of the bed were optimized with multiobjective by the response surface method and the genetic algorithm (NSGAII). Through optimization，the first to third order natural frequencies of the bed are increased by 351%, 659%, 564% respectively, and the weight of the bed is reduced by 60 kg. The overall performance of the machine tool is optimized.